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In a surprise move, version 5.2 was bypassed in favor of Pantheon version 6.0, which includes the new Xtent Technology Rules Editor and constraint manager. In addition to the major usability boost that Xtent brings to the rules management area of designs, this new version boasts more streamlined RF interfaces that continue to cut design cycle times by at least half, along with next generation auto-interactive routing and design reuse with blocks that offers flexibility above and beyond anything Pantheon has offered before. Xtent Technology Rules Editor with High Speed Constraint Management Now Available
• Full technology rules definition and assignment with updated user interface features.
• High speed design options for defining signal paths, with auto-create signal path capability.
• Auto-tune from-tos and signal paths.
• Auto-define diff-pairs.
• Xtent is available in core Pantheon, with the option to purchase a high speed design option license. Click here for additional information on Xtent. High Speed Design Update
Constraining wire and net lengths has moved to the next level with Xtent. Full signal paths containing any number of nets can now be defined and auto-tuned directly from Xtent, with wire lengths displayed and updated on the fly. Signal path topology can be further constrained from pin to pin if required, using from-to definitions within each signal path net. All information is viewed in a single panel, making edits easier than ever.
PCB Design Updates • Next generation auto-interactive routing now available. • Guide Diff-pair now available. • Blocks can now be unlocked, edited and relocked on the fly from the board view. • Changes to blocks can now be reverted. • Continued Guide Route improvements. • Continued Routing Enhancements. RF Design Updates • HFSS bidirectional interface now imports fully intelligent objects. • MWOffice bidirectional interface now includes custom scripts in MWO for Intercept-specific requirements. • Via fencing now auto-places around any selected object and inside fills. Hybrid Design Updates • Multiple wirebond wires can now be added to a single die pin and bond pad. • Wirebonds can now be offset from the origin of the pin or pad. • Wirebonds can now have reference designators. • Reference designators are automatically added to wirebonds once they are routed. Have a particular complaint or feature request you think we should focus on? We want to hear from you.
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